MediaTek unveils new 6nm-based Dimensity 900 5G SoC

Mediatek has just unveiled its newest 5G chipset, designed especially for midrange smartphones – the Dimensity 900 SoC. The chipset is built on the power-efficient 6 nm process similar to the Dimensity 1100 and Dimensity 1200. The new SoC is a quad-core chip with third-generation MediaTek APU AI.

The chipset is built on the 6 nm process technology and comes as a successor of Dimensity 800 series with faster CPUs and better connectivity. The chip comes with an octa-core CPU architecture with two Cortex-A78 cores running at upto 2.4GHz and six Cortex-A55 cores running at upto 2.00 GHz.

On the GPU front, it features the Mali-G68 MC4. The chipset gets support for 2G-5G Multi-Mode, 5G Carrier Aggregation (2CC FDD/TDD), Dual 5G connectivity (5G SA+5G SA), and VoNR (Voice over New Radio) support. As for imaging, there’s support for up to 108MP resolution and video recording at up to [email protected] fps.

Dimensity 900 SoC

Devices running on the Dimensity 900 platform can pack in a maximum of FHD+ HDR10+ displays with a high refresh rate of 120Hz. There’s support for LPDDR4X and the new LPDDR5 RAM and up to UFS 3.1 storage type. For a perspective, according to past leaks, the Dimensity 900 outperformed the Qualcomm Snapdragon 768G chipset in the AnTuTu benchmark, scoring about 480,000, compared to 440,000 of its counterparts. The Dimensity 900 SoC is codenamed MT6877 reportedly.

The chipset will be featured in many upcoming 5G mid-rangers and probably Realme will be taking advantage too. That said, which smartphones do you expect to feature this new SoC? Do let us know by dropping a comment down below.


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